The AX8300Si semiconductor micro-focus X-ray inspection device is a non-destructive testing device specifically designed for the semiconductor packaging, electronic components, and precision manufacturing fields. It uses micron-level focused X-ray technology combined with a high-precision mechanical system and intelligent image analysis software, enabling non-destructive internal inspection of chips, solder joints, packaging structures, and more.
Application areas: Precision electronics manufacturing industry, semiconductor industry (integrated circuits), automotive electronics industry, aerospace electronics industry
Inspection items: Solder defects (missing solder/solder bridging/voids), bonding defects (wire deformation/breakage/chip misalignment), SPC process control, etc.


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