Single Wafer Cleaning Machine

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Single wafer cleaning machine

1. The equipment supports 8-inch and 12-inch wafers. Switching only requires changing the FOUP adapter, without complex adjustments, making operation convenient and efficient, significantly enhancing the flexibility and switching speed of the production line.


2. Equipped with a pneumatic high-pressure pump, the pressure output can be adjusted to 60-200 KG/CM² according to process requirements. Combined with high-pressure nozzles, this effectively improves cleaning efficiency and adapts to different cleaning processes.


3. The pressure in the two-fluid system is controlled within 5 KG/CM², ensuring precise pressure regulation during cleaning, preventing damage to the wafers while improving cleaning effectiveness.

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Product Introduction

This equipment supports 8-inch and 12-inch wafers, and switching between machines only requires changing the FOUP adapter. It features multifunctional capabilities, allowing the integration of various cleaning functions according to different application needs, such as high-speed centrifugal rotation, HPC high-pressure cleaning, two-fluid cleaning, brush cleaning, SC1 chemical cleaning, and it also supports the addition of megasonic functionality to meet diverse process requirements.


The machine is particularly suitable for processes such as particle cleaning, flux cleaning, and photoresist residue cleaning. The chamber is designed using flow field simulation and is equipped with a unique sealing structure to ensure the cleanest environment for the wafers during the cleaning process.


Product Parameters

Application scope: This equipment can be used to remove particles from 4 "to 12" wafers and clean flux residues

WPH: ≥15pcs/H/Chammber (Base on TT 120s)

Chamber type: Single wafer rotary process chamber

Loading/unloading: FOUP/SMIF/Cassette

Material

External: Stainless steel; Frame: Stainless steel

Chemical selection: SC1 / SC2 / SPM

Number of recycling ring groups: up to 4 groups

Particulate matter control: ≥0.06um removal rate > 96%, residue ≤ 10E@ ≥0.06um

Noise: < 75db



Company Services

Experience and Technical Expertise in Technology and Spare Parts Maintenance Supply

  • Shenzhen Minfei Technology Co., Ltd. is a comprehensive solution provider for sales and services in the semiconductor packaging and SMT industry. We represent well-known SMT equipment brands such as the pick-and-place machines K&S (Assembleon) and ASM, reflow soldering, selective wave soldering Ersa, Sistec 3D AOI/SPI, and online substrate cleaning equipment, offering both sales and after-sales services. We have extensive experience and a solid technical foundation in technology and spare parts maintenance supply.
  • Shenzhen Minfei Technology Co., Ltd. provides customers with automated equipment solutions and can customize automation equipment according to client needs. This includes automated production line transfer equipment centered around loaders/unloaders. We also provide related design fixtures and jig products. Additionally, we focus on technical after-sales services for SMT packaging and mounting machines, including a range of high-end machines such as K&S and ASM pick-and-place machines, providing technical services and customized spare parts. We also offer full-line packaging services and on-site support.

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