FC-990 Online Cleaning Machine

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FC-990 Online Cleaner

1. This equipment is designed specifically to meet the cleaning requirements of advanced packaging process precision machining, completing the entire process of chemical cleaning, pure water rinsing, and drying in one batch during mass production. Its excellent cleaning performance ensures the effective removal of fluxes, organic and inorganic contaminants, enhancing product cleanliness, reliability, and precision performance, and is suitable for complex, high-end, and efficient industrial production needs.

2. The equipment features a unique spraying system designed for cleaning high-end precision devices with low gap areas at the bottom. The cleaning solution can fully penetrate the complex shapes of the components and their soldering gaps, ensuring thorough cleaning of both the surface and bottom gaps without blind spots. The system is designed to evenly distribute the cleaning agent, ensuring every surface of the product is effectively cleaned, improving cleaning precision and performance.

3. Equipped with a high-efficiency rinsing system combined with an extended pure water rinse section, the equipment can effectively penetrate gaps between products to achieve thorough rinsing, ensuring effective rinsing after the cleaning process without over-cleaning or excessive rinsing, and guaranteeing no residue of cleaning solution on the product. The rinsing system can use deionized water to ensure ion stability of the product during the cleaning process.

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Product Introduction
Mainly used for cleaning after soldering of SIP, FCCSP, FCBGA, and advanced packaging PCBA in mass production. Supports fully automated cleaning solutions and can be used in conjunction with loading and unloading systems. Efficiently cleans residues of flux, airborne dust particles, or other contaminants during various bonding and soldering processes. After cleaning, products can achieve a clean surface, completely free of flux, oil stains, and other contaminant residues, meeting the cleanliness requirements of various packaging processes and the precision standards of high-end semiconductor manufacturing.  
Product Parameters

 6800mm(L)x1860mm(W)x1956mm(H) Operating Surface Height: 900 (-20/+50) mm Conveying Speed: 10cm/min-150cm/minUPH: Standard Calculation Method Chain speed/(board length + board spacing)*60min* Number of parallel boards power supply: three-phase five-wire 3 Phases 5 Lines, AC 380V, 50HZ, 313A noise: < 80db Total power: 189kW Equipment net weight: 3600kgDIW/PCW: DIW: (flow rate:) PCW: (Flow rate: 100-140L/min, pressure: ≥0.3MPa, temperature: ≤18℃) CDA: Flow rate: 3-5m³/h, pressure: 0.45-0.7MPa Exhaust port specifications: Quantity: 5 EA, size: 10 inches 250mm, wind speed: ≥7m/s, total flow rate: 53m ³/min


Company Services

Experience and Technical Expertise in Technology and Spare Parts Maintenance Supply

  • Shenzhen Minfei Technology Co., Ltd. is a comprehensive solution provider for sales and services in the semiconductor packaging and SMT industry. We represent well-known SMT equipment brands such as the pick-and-place machines K&S (Assembleon) and ASM, reflow soldering, selective wave soldering Ersa, Sistec 3D AOI/SPI, and online substrate cleaning equipment, offering both sales and after-sales services. We have extensive experience and a solid technical foundation in technology and spare parts maintenance supply.
  • Shenzhen Minfei Technology Co., Ltd. provides customers with automated equipment solutions and can customize automation equipment according to client needs. This includes automated production line transfer equipment centered around loaders/unloaders. We also provide related design fixtures and jig products. Additionally, we focus on technical after-sales services for SMT packaging and mounting machines, including a range of high-end machines such as K&S and ASM pick-and-place machines, providing technical services and customized spare parts. We also offer full-line packaging services and on-site support.

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