Single Wafer Coating Machine

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Single Wafer Coater

1. Integrates cleaning, spin coating, and baking, effectively ensuring process consistency and yield.

2. High-speed spin coating precisely controls each speed segment via recipes, effectively ensuring uniform coating.

3. Multi-point heating on a uniformly heated plate effectively ensures stable and consistent drying.

4. Automatic Load Port and mainstream E84 sensors interface with OHT vehicles, providing stability and efficiency.

5. User-friendly operation interface allows operators to intuitively and quickly operate the machine.

6. Each chamber can be controlled and operated independently without interference.

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Product Introduction

Suitable for 6"/8"/12" photoresist spin coating, homogenization, and curing processes.

The equipment is equipped with a multi-stage precision filtration system to effectively ensure the cleanliness of the silicon wafer before coating.

The maximum speed of Spin Chuck is 5000RPM, and the recipe can be set up to 21 segments, effectively ensuring the uniformity of the uniformity.

The multi-point heating vapor chamber plate effectively ensures the uniformity of the drying temperature and avoids the occurrence of adverse events caused by local temperature differences.

It supports EAP/MES/AMHS mainstream communication protocols, and SECS/GEM200/300 supports OHT/PGV/AGV equipment docking in compliance with SEMIS2 and CE semiconductor manufacturing standards and certifications.


Product Parameters

Equipment size: 4250 mm (L) x 2500 mm (W) x 2800 mm (H) (including goblet + vent height) are for reference only application range: 12 inches large wafers, SiC substrate and epitaxial wafer, sapphire substrate vehicle type: 12-inch Wafer foups, 6/8 inch Open Cassette, 8 inch SMIF Pod FPH: 90 PCS/Chamber or higher coating uniformity: 3% or less (inside/pills) for Wafer size (diameter) : 150 mm, 200 mm, 300 mm fragment rate: < 1/100000 Spin Chuck revolutions: Max. 5000 RPM power supply: three-phase five line AC380V 50 hz power rating 35 kw; Noise: < 75 db coating effect: no coating powder, stripes and color changing equipment net weight: 2000 kg main material: the fuselage: PP pipeline: PFA


Company Services

Experience and Technical Expertise in Technology and Spare Parts Maintenance Supply

  • Shenzhen Minfei Technology Co., Ltd. is a comprehensive solution provider for sales and services in the semiconductor packaging and SMT industry. We represent well-known SMT equipment brands such as the pick-and-place machines K&S (Assembleon) and ASM, reflow soldering, selective wave soldering Ersa, Sistec 3D AOI/SPI, and online substrate cleaning equipment, offering both sales and after-sales services. We have extensive experience and a solid technical foundation in technology and spare parts maintenance supply.
  • Shenzhen Minfei Technology Co., Ltd. provides customers with automated equipment solutions and can customize automation equipment according to client needs. This includes automated production line transfer equipment centered around loaders/unloaders. We also provide related design fixtures and jig products. Additionally, we focus on technical after-sales services for SMT packaging and mounting machines, including a range of high-end machines such as K&S and ASM pick-and-place machines, providing technical services and customized spare parts. We also offer full-line packaging services and on-site support.

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