1. Professionally designed to meet the cleaning requirements of the semiconductor automation industry, it features fully automated cleaning capabilities, enabling rapid completion of chemical cleaning, pure water rinsing, and drying processes on the production line. It is compatible with various types of products and offers excellent cleaning performance. It ensures thorough removal of flux, organic and inorganic contaminants from product surfaces, meeting the precision requirements of clean processes, greatly improving product cleanliness. Its inline design meets the needs of large-scale automated industrial production.
2. The equipment is equipped with a unique spray system, designed for cleaning large-size, low-gap precision components, capable of cleaning complex-shaped parts thoroughly, ensuring no blind spots. This system evenly distributes cleaning agents, ensuring every surface is effectively cleaned, enhancing cleaning precision and efficiency.
3. Equipped with a high-efficiency air knife water-cutting system combined with an extra-long air knife drying section, it can quickly blow off water from the surface of components, ensuring no water residues remain on cleaned products. At the same time, rapid air knife drying greatly improves overall production efficiency.
6800mm(L)x1860mm(W)x1956mm(H) Operating Surface Height: 900 (-20/+50) mm Conveying Speed: 10cm/min-150cm/minUPH: Standard Calculation Method Chain speed/(board length + board spacing)*60min* Number of parallel boards power supply: three-phase five-wire 3 Phases 5 Lines, AC 380V, 50HZ, 313A noise: < 80db Total power: 189kW Equipment net weight: 3600kgDIW/PCW: DIW: (flow rate:) PCW: (Flow rate: 100-140L/min, pressure: ≥0.3MPa, temperature: ≤18℃) CDA: Flow rate: 3-5m³/h, pressure: 0.45-0.7MPa Exhaust port specifications: Quantity: 5 EA, size: 10 inches 250mm, wind speed: ≥7m/s, total flow rate: 53m ³/min

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